Carbon nanotubes are welded to metal electrodes

The research group led by Professor Zhang Yafei of the Micro-Nano Research Institute of Shanghai Jiaotong University successfully achieved the welding of carbon nanotubes and metal electrodes, and made important progress in the research of nano-device processing technology.

At present, the minimum characteristic line width of processing devices in the semiconductor industry is about 65 nanometers, and further narrowing the line width will greatly increase the complexity of the process and the processing cost, thereby limiting the speed, the smaller, the colder and the lower the price. Development of electronic devices. In recent years, many scientists in the world have been conducting research on nanodevices using Bottom-Up construction methods of nano-functional materials. However, the lack of a reliable method for realizing the combination of nanomaterials and metal electrodes has limited the research. The development of direction.

Professor Zhang Yafei's research group successfully used carbon nanotubes on the metal surface by using a sub-microsonic ultra-high frequency micro-vibration pressure head to successfully embed and weld the carbon nanotubes onto the metal electrodes to form a reliable electricity. Contact connections and bonding. The experiment proves that the nano-welded joint between the carbon nanotube and the metal electrode has strong mechanical strength, and the nano-electronic device formed by welding the carbon nanotube material has superior performance; they further prove that the technology is applicable not only by the experiment. It is used for bonding between a variety of one-dimensional nanomaterials such as Si, SiC nanowires and the like, and can be applied to bonding and composite processing between other nanomaterials and metals. Therefore, nano-welding technology has broken through the bottleneck of nano-device processing technology and solved a key nano-fabrication technology for preparing nano-material-based nanodevices by Bottom-Up method.

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